DESCRIPTION
POLYIMIDE FILM/KAPTON
Description
Polyimide Film is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA ). It shows outstanding physical , thermal, electrical, and chemical properties over a wide range of temperature as low as
Features
Operating temperatures: Class H (
Unique combination of electrical, thermal, chemical and mechanical properties
Applications
It’s extensively used in electrical insulation, flexible printed circuits, bar code labels, pressure sensitive tape and safety applications
Available
Thickness: (micron/mil)
25/1, 50/2, 75/3, 100/4, 125/5, 150/6, 175/7, 200/8, 250/10
Width:
Length:
Any special size is available on request
Technical Data
Density : 1.42+/-0.02 g/cm3 |
Tensile Strength : 135 MPa (MD), 115 MPa (TD) |
Elongation : 35 % |
Shrinkage : 1.0 % (150℃), 3.0 % (400C) |
Breakdown Strength : 150 MV/m (50HZ) |
Surface Resistivity : 1.0x10e13 Ω (200C) |
Volume Resistivity : 1.0x10e10 Ω (200C) |
Dielectric Constant : 3.5+/-0.4 (50HZ) |
Loss Tangent : 4.0x10e-3 (48~62HZ) |
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