Polyimide Film/Kapton
Description
Polyimide Film is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA ). It shows outstanding physical , thermal, electrical, and chemical properties over a wide range of temperature as low as -452F(-269C) and as high as 500F(+260C).It also offers good dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed or adhesive coated.
Features
Operating temperatures: Class H (180’C)
Unique combination of electrical, thermal, chemical and mechanical properties
Applications
It’s extensively used in electrical insulation, flexible printed circuits, bar code labels, pressure sensitive tape and safety applications
Available
Thickness: (um/mil)
7.6/0.3, 10.2/0.4, 12.7/0.5, 15/0.6, 19.1/0.75, 25.4/1.0, 50.8/2.0, 76.2/3.0
Width: 260mm, 520mm, 620mm
Length: 500m, 750m, 1000m, 1500m, 3000m
Any special size is available on request
Technical Data
Density : 1.42+/-0.02 g/cm3
Tensile Strength : 135 MPa (MD), 115 MPa (TD)
Elongation : 35 %
Shrinkage : 1.0 % (150℃), 3.0 % (400C)
Breakdown Strength : 150 MV/m (50HZ)
Surface Resistivity : 1.0x10e13 Ω (200C)
Volume Resistivity : 1.0x10e10 Ω (200C)
Dielectric Constant : 3.5+/-0.4 (50HZ)
Loss Tangent : 4.0x10e-3 (48~62HZ)
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